Products Description
PCB Automatic Glue Coating and Drying Line: An Integrated Automated Solution for Glue Coating and Curing
The automatic glue coating and drying line is a core automated equipment in industrial production that enables seamless connection between precise glue coating and efficient curing. By integrating an automatic glue supply system, a precision glue coating mechanism, and an intelligent drying module, it combines the "glue coating - drying - curing" process into a continuous operation chain. This completely replaces the inefficient traditional mode of manual glue coating and segmented drying, providing a standardized solution for production scenarios that require stable bonding effects.
Core Technical Highlights: Triple Breakthroughs in Precision, Efficiency, and Stability
Automated Precision Glue Coating: Equipped with a servo drive system and a visual positioning module, it can preset parameters based on workpiece size and glue coating path, achieving millimeter - level glue coating precision. This avoids problems such as glue overflow and glue breakage in manual glue coating, ensuring uniform thickness of the glue layer on every bonding surface.
Synchronized Efficient Drying: After the glue coating process is completed, the workpiece directly enters the connected drying unit (such as a hot air circulation chamber or an infrared drying section). The intelligent temperature control system adjusts the temperature and air speed in real - time to match the curing characteristics of different glues. This greatly shortens the drying cycle and prevents the glue layer from cracking or peeling due to temperature differences.
Full - process Controllability: It is equipped with a human - machine interface and a data monitoring system, which can record key parameters such as glue coating amount, drying temperature, and production rhythm in real - time. It also supports the storage and retrieval of process parameters, which not only ensures the consistency of mass production but also facilitates subsequent process optimization and quality traceability.
Applicable Scenarios: Covering Bonding and Curing Needs of Multiple Industries
Electronic Manufacturing: Used for fixing components on PCB boards and bonding FPC flexible boards. It ensures rapid curing of the glue layer without damaging precision components, meeting the requirements of miniaturization and high reliability of electronic products.
Automotive Components: Suitable for drying after glue coating of door sealants and lamp assemblies. It can achieve stable curing in both high - temperature and low - temperature environments, ensuring the long - term durability of automotive components.
Furniture and Building Materials: Targeting the drying of board edge - banding glue and glass splicing glue, it realizes immediate curing after glue coating, avoids workpiece displacement, and improves the production efficiency and finished product aesthetics of furniture and building materials.
